Packaged semiconductor device



FIG. 1 is a perspective view from the back right side and above the packaged semiconductor device;

FIG. 2 is a perspective view from the front left side and above the packaged semiconductor device;

FIG. 3 is a perspective view from the front left side and below the packaged semiconductor device;

FIG. 4 is a top view of the packaged semiconductor device;

FIG. 5 is a bottom view of the packaged semiconductor device;

FIG. 6 is an elevational view from the left side of the packaged semiconductor device;

FIG. 7 is an elevational view from the right side of the packaged semiconductor device;

FIG. 8 is an elevational view from the back side of the packaged semiconductor device; and,

FIG. 9 is an elevational view from the front side of the packaged semiconductor device. 

We claim the ornamental design for a packaged semiconductor device, as shown and described. 